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High density 3-D stack structure for SIP solutions

dc.contributor.authorStoukatch, Serguei
dc.contributor.authorHo, Meng
dc.contributor.authorVaesen, Kristof
dc.contributor.authorWebers, Tomas
dc.contributor.authorCarchon, Geert
dc.contributor.authorDe Raedt, Walter
dc.contributor.authorBeyne, Eric
dc.contributor.authorDe Baets, Johan
dc.contributor.authorNaem, Abdalla
dc.contributor.authorPoddar, Anindya
dc.date.accessioned2021-10-15T06:52:11Z
dc.date.available2021-10-15T06:52:11Z
dc.date.issued2003
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/8190
dc.sourceIIOimport
dc.titleHigh density 3-D stack structure for SIP solutions
dc.typeProceedings paper
dc.contributor.imecauthorVaesen, Kristof
dc.contributor.imecauthorWebers, Tomas
dc.contributor.imecauthorDe Raedt, Walter
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorDe Baets, Johan
dc.contributor.orcidimecVaesen, Kristof::0000-0001-9971-3593
dc.contributor.orcidimecDe Raedt, Walter::0000-0002-7117-7976
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.beginpage341
dc.source.endpage343
dc.source.conference14th European Microelectronics and Packaging Conference & Exhibition - EMPC
dc.source.conferencedate23/02/2003
dc.source.conferencelocationFriedrichshafen Germany
imec.availabilityPublished - imec


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