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Numerical analysis of electromigration in thin film VLSI interconnections
Publication:
Numerical analysis of electromigration in thin film VLSI interconnections
Date
1995
Proceedings Paper
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Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Petrescu, Violeta
;
Mouthaan, T.
;
Schoenmaker, Wim
;
Angelescu, Serban
;
Vissarion, R.
;
Dima, G.
;
Wallinga, H.
;
Profirescu, M. D.
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Abstract
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Views
1993
since deposited on 2021-09-29
409
item.page.metrics.field.last-week
Acq. date: 2025-10-24
Citations
Metrics
Views
1993
since deposited on 2021-09-29
409
item.page.metrics.field.last-week
Acq. date: 2025-10-24
Citations