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RF-MEMS: materials and technology, integration and packaging

dc.contributor.authorTilmans, Harrie
dc.date.accessioned2021-10-15T06:58:21Z
dc.date.available2021-10-15T06:58:21Z
dc.date.issued2003
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/8214
dc.sourceIIOimport
dc.titleRF-MEMS: materials and technology, integration and packaging
dc.typeProceedings paper
dc.contributor.imecauthorTilmans, Harrie
dc.contributor.orcidimecTilmans, Harrie::0000-0003-4240-4962
dc.source.peerreviewno
dc.source.beginpageB6.6
dc.source.conferenceMaterials, Integration and Packaging Issues for High-Frequency Devices
dc.source.conferencedate1/12/2003
dc.source.conferencelocationBoston, MA USA
imec.availabilityPublished - imec
imec.internalnotesMaterials Research Symposium Proceedings; Vol.783


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