dc.contributor.author | Vandecasteele, Bjorn | |
dc.contributor.author | Podprocky, Tomas | |
dc.contributor.author | Vanfleteren, Jan | |
dc.contributor.author | Määttänen, Jarmo | |
dc.date.accessioned | 2021-10-15T07:23:11Z | |
dc.date.available | 2021-10-15T07:23:11Z | |
dc.date.issued | 2003 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/8309 | |
dc.source | IIOimport | |
dc.title | Low temperature flip chip with adhesives on PES | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Vandecasteele, Bjorn | |
dc.contributor.imecauthor | Vanfleteren, Jan | |
dc.contributor.orcidimec | Vanfleteren, Jan::0000-0002-9654-7304 | |
dc.date.embargo | 9999-12-31 | |
dc.source.peerreview | no | |
dc.source.beginpage | 319 | |
dc.source.endpage | 324 | |
dc.source.conference | 14th European Microelectronics and Packaging Conference & Exhibition | |
dc.source.conferencedate | 23/06/2003 | |
dc.source.conferencelocation | Friedrichshafen Germany | |
imec.availability | Published - open access | |