dc.contributor.author | Vandevelde, Bart | |
dc.contributor.author | Gonzalez, Mario | |
dc.contributor.author | Beyne, Eric | |
dc.contributor.author | Zhang, G.Q. | |
dc.contributor.author | Caers, J. | |
dc.date.accessioned | 2021-10-15T07:30:29Z | |
dc.date.available | 2021-10-15T07:30:29Z | |
dc.date.issued | 2003 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/8335 | |
dc.source | IIOimport | |
dc.title | Optimal choice of the FEM damage volumes for estimation of the solder joint reliability for electronic package assemblies | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Vandevelde, Bart | |
dc.contributor.imecauthor | Gonzalez, Mario | |
dc.contributor.imecauthor | Beyne, Eric | |
dc.contributor.orcidimec | Vandevelde, Bart::0000-0002-6753-6438 | |
dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
dc.source.peerreview | no | |
dc.source.beginpage | 589 | |
dc.source.endpage | 596 | |
dc.source.conference | Proceedings of the 53rd Electronic Components and Technology Conference | |
dc.source.conferencedate | 27/05/2003 | |
dc.source.conferencelocation | New Orleans, LA USA | |
imec.availability | Published - imec | |