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Corrosion inhibition by self-assembled monolayers for enhanced wire bonding on Cu surfaces

dc.contributor.authorWhelan, Caroline
dc.contributor.authorKinsella, Michael
dc.contributor.authorCarbonell, Laure
dc.contributor.authorHo, Meng
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-10-15T07:47:48Z
dc.date.available2021-10-15T07:47:48Z
dc.date.issued2003
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/8399
dc.sourceIIOimport
dc.titleCorrosion inhibition by self-assembled monolayers for enhanced wire bonding on Cu surfaces
dc.typeJournal article
dc.contributor.imecauthorMaex, Karen
dc.source.peerreviewno
dc.source.beginpage551
dc.source.endpage557
dc.source.journalMicroelectronic Engineering
dc.source.issue2_4
dc.source.volume70
imec.availabilityPublished - imec
imec.internalnotesMaterials for Advanced Metallization 2003


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