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dc.contributor.authorWu, Wen
dc.contributor.authorJonckheere, Rik
dc.contributor.authorTokei, Zsolt
dc.contributor.authorStucchi, Michele
dc.contributor.authorStruyf, Herbert
dc.contributor.authorVos, Ingrid
dc.contributor.authorBender, Hugo
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-10-15T07:51:50Z
dc.date.available2021-10-15T07:51:50Z
dc.date.issued2003
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/8414
dc.sourceIIOimport
dc.titleResistivity of ultra-narrow Cu interconnects fabricated with ion beam lithography
dc.typeProceedings paper
dc.contributor.imecauthorJonckheere, Rik
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorStucchi, Michele
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.imecauthorVos, Ingrid
dc.contributor.imecauthorBender, Hugo
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecJonckheere, Rik::0000-0003-2211-9443
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage345
dc.source.endpage348
dc.source.conferenceProceedings of the Advanced Metallization Conference 2002
dc.source.conferencedate1/10/2002
dc.source.conferencelocationSan Diego, CA USA
imec.availabilityPublished - open access


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