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The thickness and temperature dependent resistivity of thin copper films

dc.contributor.authorZhang, Wenqi
dc.contributor.authorBrongersma, Sywert
dc.contributor.authorClarysse, Trudo
dc.contributor.authorWu, Wen
dc.contributor.authorVervoort, Iwan
dc.contributor.authorPalmans, Roger
dc.contributor.authorHoflijk, Ilse
dc.contributor.authorBender, Hugo
dc.contributor.authorHui, W.
dc.contributor.authorCarbonell, Laure
dc.contributor.authorRosseel, Erik
dc.contributor.authorVandervorst, Wilfried
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-10-15T07:58:33Z
dc.date.available2021-10-15T07:58:33Z
dc.date.issued2003
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/8437
dc.sourceIIOimport
dc.titleThe thickness and temperature dependent resistivity of thin copper films
dc.typeOral presentation
dc.contributor.imecauthorBrongersma, Sywert
dc.contributor.imecauthorHoflijk, Ilse
dc.contributor.imecauthorBender, Hugo
dc.contributor.imecauthorRosseel, Erik
dc.contributor.imecauthorVandervorst, Wilfried
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecBrongersma, Sywert::0000-0002-1755-3897
dc.source.peerreviewno
dc.source.conferenceAdvanced Metallization Conference - AMC
dc.source.conferencedate21/10/2003
dc.source.conferencelocationMontreal Canada
imec.availabilityPublished - imec


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