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More than just a package - wafer-level packaging of MEMS
Publication:
More than just a package - wafer-level packaging of MEMS
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Date
2004
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Baert, Kris
;
De Moor, Piet
;
Tilmans, Harrie
;
John, Joachim
;
Witvrouw, Ann
;
Van Hoof, Chris
;
Beyne, Eric
Journal
European Semiconductor
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1820
since deposited on 2021-10-15
Acq. date: 2026-07-17
Citations
Statistics
Views
1820
since deposited on 2021-10-15
Acq. date: 2026-07-17
Citations