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More than just a package - wafer-level packaging of MEMS

dc.contributor.authorBaert, Kris
dc.contributor.authorDe Moor, Piet
dc.contributor.authorTilmans, Harrie
dc.contributor.authorJohn, Joachim
dc.contributor.authorWitvrouw, Ann
dc.contributor.authorVan Hoof, Chris
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-15T12:39:55Z
dc.date.available2021-10-15T12:39:55Z
dc.date.issued2004-06
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/8512
dc.sourceIIOimport
dc.titleMore than just a package - wafer-level packaging of MEMS
dc.typeJournal article
dc.contributor.imecauthorDe Moor, Piet
dc.contributor.imecauthorTilmans, Harrie
dc.contributor.imecauthorJohn, Joachim
dc.contributor.imecauthorVan Hoof, Chris
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecTilmans, Harrie::0000-0003-4240-4962
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.beginpage27
dc.source.endpage29
dc.source.journalEuropean Semiconductor
dc.source.issue6
dc.source.volume26
imec.availabilityPublished - imec


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