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Challenges of clean/strip processing for Cu/LowK technology

dc.contributor.authorBaklanov, Mikhaïl
dc.contributor.authorLe, Quoc Toan
dc.contributor.authorKesters, Els
dc.contributor.authorIacopi, Francesca
dc.contributor.authorVan Aelst, Joke
dc.contributor.authorStruyf, Herbert
dc.contributor.authorBoullart, Werner
dc.contributor.authorVanhaelemeersch, Serge
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-10-15T12:40:30Z
dc.date.available2021-10-15T12:40:30Z
dc.date.issued2004
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/8526
dc.sourceIIOimport
dc.titleChallenges of clean/strip processing for Cu/LowK technology
dc.typeProceedings paper
dc.contributor.imecauthorLe, Quoc Toan
dc.contributor.imecauthorKesters, Els
dc.contributor.imecauthorVan Aelst, Joke
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.imecauthorBoullart, Werner
dc.contributor.imecauthorVanhaelemeersch, Serge
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecLe, Quoc Toan::0000-0002-0206-6279
dc.contributor.orcidimecBoullart, Werner::0000-0001-7614-2097
dc.contributor.orcidimecVanhaelemeersch, Serge::0000-0003-2102-7395
dc.source.peerreviewno
dc.source.beginpage187
dc.source.endpage189
dc.source.conferenceProceedings of the IEEE International Interconnect Technology Conference - IITC
dc.source.conferencedate7/06/2004
dc.source.conferencelocationSan Francisco, CA USA
imec.availabilityPublished - imec


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