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3D Interconnection and packaging: impending reality or still a dream?

dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-15T12:43:10Z
dc.date.available2021-10-15T12:43:10Z
dc.date.issued2004
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/8575
dc.sourceIIOimport
dc.title3D Interconnection and packaging: impending reality or still a dream?
dc.typeProceedings paper
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.beginpage138
dc.source.endpage145
dc.source.conferenceIEEE International Solid-State Circuits Conference - ISSCC. Digest of Technical Papers
dc.source.conferencedate15/02/2004
dc.source.conferencelocationSan Francisco, CA USA
imec.availabilityPublished - imec


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