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Multilayer thin film technology for systems packaging

dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-15T12:43:13Z
dc.date.available2021-10-15T12:43:13Z
dc.date.issued2004
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/8576
dc.sourceIIOimport
dc.titleMultilayer thin film technology for systems packaging
dc.typeOral presentation
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.conferenceIEEE Systems Packaging Japan Workshop
dc.source.conferencedate2/02/2004
dc.source.conferencelocationHakone Japan
imec.availabilityPublished - imec


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