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Ultradense packaging aspects. 3D interconnection and packaging: impending reality or still a dream?

dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-15T12:43:17Z
dc.date.available2021-10-15T12:43:17Z
dc.date.issued2004
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/8577
dc.sourceIIOimport
dc.titleUltradense packaging aspects. 3D interconnection and packaging: impending reality or still a dream?
dc.typeOral presentation
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.conferenceIMAPS-France, Interconex
dc.source.conferencedate4/05/2004
dc.source.conferencelocationVersailles France
imec.availabilityPublished - imec


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