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High density multilayer thin film interconnect technologies for SiP

dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-15T12:43:24Z
dc.date.available2021-10-15T12:43:24Z
dc.date.issued2004
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/8579
dc.sourceIIOimport
dc.titleHigh density multilayer thin film interconnect technologies for SiP
dc.typeOral presentation
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.conferenceENCAST Workshop
dc.source.conferencedate26/05/2004
dc.source.conferencelocationVillach Austria
imec.availabilityPublished - imec


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