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Copper grain growth in reduced dimensions

dc.contributor.authorBrongersma, Sywert
dc.contributor.authorVanstreels, Kris
dc.contributor.authorWu, W.
dc.contributor.authorZhang, Wenqi
dc.contributor.authorErnur, Didem
dc.contributor.authorD'Haen, Jan
dc.contributor.authorTerzieva, Valentina
dc.contributor.authorVan Hove, Marleen
dc.contributor.authorClarysse, Trudo
dc.contributor.authorCarbonell, Laure
dc.contributor.authorVandervorst, Wilfried
dc.contributor.authorDe Ceuninck, Ward
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-10-15T12:48:09Z
dc.date.available2021-10-15T12:48:09Z
dc.date.issued2004-06
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/8641
dc.sourceIIOimport
dc.titleCopper grain growth in reduced dimensions
dc.typeProceedings paper
dc.contributor.imecauthorBrongersma, Sywert
dc.contributor.imecauthorVanstreels, Kris
dc.contributor.imecauthorErnur, Didem
dc.contributor.imecauthorD'Haen, Jan
dc.contributor.imecauthorTerzieva, Valentina
dc.contributor.imecauthorVandervorst, Wilfried
dc.contributor.imecauthorDe Ceuninck, Ward
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecBrongersma, Sywert::0000-0002-1755-3897
dc.contributor.orcidimecVanstreels, Kris::0000-0002-4420-0966
dc.source.peerreviewyes
dc.source.beginpage48
dc.source.endpage50
dc.source.conferenceProceedings of the IEEE International Interconnect Technology Conference - IITC
dc.source.conferencedate7/06/2004
dc.source.conferencelocationSan Fransisco, CA USA
imec.availabilityPublished - imec


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