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dc.contributor.authorSercu, Stefaan
dc.contributor.authorMartens, Luc
dc.date.accessioned2021-09-29T13:16:23Z
dc.date.available2021-09-29T13:16:23Z
dc.date.issued1995
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/864
dc.sourceIIOimport
dc.titleExperimental circuit modeling of coupled interconnection structures based on causality
dc.typeProceedings paper
dc.contributor.imecauthorMartens, Luc
dc.source.peerreviewno
dc.source.beginpage120
dc.source.endpage122
dc.source.conferenceProceedings IEEE 4th Topical Meeting on Electrical Performance of Electronic Packaging; 2-4 Oct. 1995; Portland, OR, USA.
dc.source.conferencelocation
imec.availabilityPublished - imec


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