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Wafer-level package integrated functions

dc.contributor.authorCarchon, Geert
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-15T12:49:24Z
dc.date.available2021-10-15T12:49:24Z
dc.date.issued2004-09
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/8655
dc.sourceIIOimport
dc.titleWafer-level package integrated functions
dc.typeProceedings paper
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.beginpage284
dc.source.endpage285
dc.source.conferenceExtended Abstracts International Conference on Solid State Devices and Materials
dc.source.conferencedate14/09/2004
dc.source.conferencelocationTokyo Japan
imec.availabilityPublished - imec


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