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Ultra-shallow junction process development for the 45nm CMOS technology node using co-implantation

dc.contributor.authorCollart, E.J.H.
dc.contributor.authorKirkwood, D.
dc.contributor.authorLindsay, Richard
dc.contributor.authorVandervorst, Wilfried
dc.contributor.authorPawlak, Bartek
dc.date.accessioned2021-10-15T12:55:17Z
dc.date.available2021-10-15T12:55:17Z
dc.date.issued2004
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/8709
dc.sourceIIOimport
dc.titleUltra-shallow junction process development for the 45nm CMOS technology node using co-implantation
dc.typeOral presentation
dc.contributor.imecauthorVandervorst, Wilfried
dc.contributor.imecauthorPawlak, Bartek
dc.source.peerreviewno
dc.source.conference15th International Conference on Ion Implantation Technology
dc.source.conferencedate24/10/2004
dc.source.conferencelocationTaiwan
imec.availabilityPublished - imec


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