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Low temperature zero-level packaging of MEMS

dc.contributor.authorDe Moor, Piet
dc.contributor.authorBaert, Kris
dc.contributor.authorBeyne, Eric
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorTilmans, Harrie
dc.contributor.authorVan Hoof, Chris
dc.date.accessioned2021-10-15T13:04:25Z
dc.date.available2021-10-15T13:04:25Z
dc.date.issued2004-04
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/8777
dc.sourceIIOimport
dc.titleLow temperature zero-level packaging of MEMS
dc.typeProceedings paper
dc.contributor.imecauthorDe Moor, Piet
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorTilmans, Harrie
dc.contributor.imecauthorVan Hoof, Chris
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecTilmans, Harrie::0000-0003-4240-4962
dc.source.peerreviewno
dc.source.beginpage261
dc.source.endpage264
dc.source.conferenceProceedings of the 5th ISMAN International Symposium on MEMS and Nanotechnology
dc.source.conferencedate7/06/2004
dc.source.conferencelocationCosta Mesa, CA USA
imec.availabilityPublished - imec


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