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The Minipackage: a flexible wafer-level packaging solution for MEMS

dc.contributor.authorDe Moor, Piet
dc.contributor.authorBaert, Kris
dc.contributor.authorBogaerts, Lieve
dc.contributor.authorDu Bois, Bert
dc.contributor.authorJamieson, Geraldine
dc.contributor.authorJourdain, Anne
dc.contributor.authorVan Hoof, Chris
dc.date.accessioned2021-10-15T13:04:33Z
dc.date.available2021-10-15T13:04:33Z
dc.date.issued2004
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/8778
dc.sourceIIOimport
dc.titleThe Minipackage: a flexible wafer-level packaging solution for MEMS
dc.typeOral presentation
dc.contributor.imecauthorDe Moor, Piet
dc.contributor.imecauthorBogaerts, Lieve
dc.contributor.imecauthorDu Bois, Bert
dc.contributor.imecauthorJamieson, Geraldine
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorVan Hoof, Chris
dc.contributor.orcidimecDu Bois, Bert::0000-0003-0147-1296
dc.contributor.orcidimecJamieson, Geraldine::0000-0002-6750-097X
dc.source.peerreviewno
dc.source.conferenceIMAPS 6th Workshop on Packaging of MEMS
dc.source.conferencedate18/11/2004
dc.source.conferencelocationLong Beach, CA USA
imec.availabilityPublished - imec


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