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Thin film passives technology as an enabling technology for RF SiP integration

dc.contributor.authorDe Raedt, Walter
dc.contributor.authorTilmans, Harrie
dc.date.accessioned2021-10-15T13:06:00Z
dc.date.available2021-10-15T13:06:00Z
dc.date.issued2004
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/8788
dc.sourceIIOimport
dc.titleThin film passives technology as an enabling technology for RF SiP integration
dc.typeOral presentation
dc.contributor.imecauthorDe Raedt, Walter
dc.contributor.imecauthorTilmans, Harrie
dc.contributor.orcidimecDe Raedt, Walter::0000-0002-7117-7976
dc.contributor.orcidimecTilmans, Harrie::0000-0003-4240-4962
dc.source.peerreviewno
dc.source.conferenceMEMSWAVE
dc.source.conferencedate30/06/2004
dc.source.conferencelocationUppsala Sweden
imec.availabilityPublished - imec


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