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MEMS and thin film passives technologies for new Systems in a Package

dc.contributor.authorDe Raedt, Walter
dc.contributor.authorTilmans, Harrie
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-15T13:06:08Z
dc.date.available2021-10-15T13:06:08Z
dc.date.issued2004
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/8789
dc.sourceIIOimport
dc.titleMEMS and thin film passives technologies for new Systems in a Package
dc.typeOral presentation
dc.contributor.imecauthorDe Raedt, Walter
dc.contributor.imecauthorTilmans, Harrie
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecDe Raedt, Walter::0000-0002-7117-7976
dc.contributor.orcidimecTilmans, Harrie::0000-0003-4240-4962
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.conferenceJapan SiP Forum
dc.source.conferencedate14/05/2004
dc.source.conferencelocationTokyo Japan
imec.availabilityPublished - imec


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