Show simple item record

Corrosion of the copper damascene interconnects as a function of the electrochemical plating process parameters

dc.contributor.authorErnur, Didem
dc.contributor.authorWu, Wen
dc.contributor.authorBrongersma, Sywert
dc.contributor.authorTerzieva, Valentina
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-10-15T13:22:25Z
dc.date.available2021-10-15T13:22:25Z
dc.date.issued2004
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/8891
dc.sourceIIOimport
dc.titleCorrosion of the copper damascene interconnects as a function of the electrochemical plating process parameters
dc.typeProceedings paper
dc.contributor.imecauthorErnur, Didem
dc.contributor.imecauthorBrongersma, Sywert
dc.contributor.imecauthorTerzieva, Valentina
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecBrongersma, Sywert::0000-0002-1755-3897
dc.source.peerreviewno
dc.source.beginpageK6.1
dc.source.conferenceAdvances in Chemical Mechanical Polishing
dc.source.conferencedate12/04/2004
dc.source.conferencelocationSan Francisco, CA USA
imec.availabilityPublished - imec
imec.internalnotesMaterial Research Society Symposium Proceedings; Vol. 816


Files in this item

FilesSizeFormatView

There are no files associated with this item.

This item appears in the following collection(s)

Show simple item record