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Influence of electrochemical plating process parameters on corrosion of Cu damascene interconnects

dc.contributor.authorErnur, Didem
dc.contributor.authorWu, Wen
dc.contributor.authorBrongersma, Sywert
dc.contributor.authorTerzieva, Valentina
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-10-15T13:22:36Z
dc.date.available2021-10-15T13:22:36Z
dc.date.issued2004
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/8892
dc.sourceIIOimport
dc.titleInfluence of electrochemical plating process parameters on corrosion of Cu damascene interconnects
dc.typeProceedings paper
dc.contributor.imecauthorErnur, Didem
dc.contributor.imecauthorBrongersma, Sywert
dc.contributor.imecauthorTerzieva, Valentina
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecBrongersma, Sywert::0000-0002-1755-3897
dc.source.peerreviewno
dc.source.beginpage183
dc.source.endpage188
dc.source.conferenceAdvances in Chemical-Mechanical Polishing
dc.source.conferencedate12/04/2004
dc.source.conferencelocationSan Francisco, CA USA
imec.availabilityPublished - imec
imec.internalnotesMaterials Research Society Proceedings; Vol. 816


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