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Integration of low stress photopatternable silicones into a wafer level package

dc.contributor.authorGardner, G.
dc.contributor.authorHarkness, B.
dc.contributor.authorOhare, E.
dc.contributor.authorMeynen, H.
dc.contributor.authorVanden Bulcke, Mathieu
dc.contributor.authorGonzalez, Mario
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-15T13:31:04Z
dc.date.available2021-10-15T13:31:04Z
dc.date.issued2004-06
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/8939
dc.sourceIIOimport
dc.titleIntegration of low stress photopatternable silicones into a wafer level package
dc.typeProceedings paper
dc.contributor.imecauthorVanden Bulcke, Mathieu
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.beginpage170
dc.source.endpage174
dc.source.conferenceProceedings of the 54th Electronic Components and Technology Conference - ECTC
dc.source.conferencedate1/06/2004
dc.source.conferencelocationLas Vegas, NV USA
imec.availabilityPublished - imec


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