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LIDCAT: graded build-up technology for printed circuit boards

dc.contributor.authorGielen, An
dc.contributor.authorVereeken, M.
dc.contributor.authorDe Baets, Johan
dc.contributor.authorMorrell, M.
dc.contributor.authorBeadel, M.
dc.contributor.authorVaudolon, J.
dc.contributor.authorAllard, P.
dc.contributor.authorBlansaer, E.
dc.contributor.authorColson, P.
dc.contributor.authorIllyefalvi-Vitez, Z.
dc.contributor.authorGordon, P.
dc.date.accessioned2021-10-15T13:35:34Z
dc.date.available2021-10-15T13:35:34Z
dc.date.issued2004
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/8962
dc.sourceIIOimport
dc.titleLIDCAT: graded build-up technology for printed circuit boards
dc.typeProceedings paper
dc.contributor.imecauthorDe Baets, Johan
dc.source.peerreviewno
dc.source.beginpage111
dc.source.endpage116
dc.source.conferenceProceedings European Microelectronics and Packaging Symposium
dc.source.conferencedate16/06/2004
dc.source.conferencelocationPrague Czech Republic
imec.availabilityPublished - imec


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