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Photopatternable silicone compositions for electronics packaging applications

dc.contributor.authorHarkness, Brian R.
dc.contributor.authorGardner, Geoff B.
dc.contributor.authorAlger, James S.
dc.contributor.authorCummings, Michelle R.
dc.contributor.authorPrincing, Jennifer
dc.contributor.authorLee, Yeong
dc.contributor.authorMeynen, Herman
dc.contributor.authorGonzalez, Mario
dc.contributor.authorVandevelde, Bart
dc.contributor.authorVanden Bulcke, Mathieu
dc.contributor.authorWinters, Christophe
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-15T13:42:38Z
dc.date.available2021-10-15T13:42:38Z
dc.date.issued2004
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/8998
dc.sourceIIOimport
dc.titlePhotopatternable silicone compositions for electronics packaging applications
dc.typeProceedings paper
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorVanden Bulcke, Mathieu
dc.contributor.imecauthorWinters, Christophe
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.beginpage517
dc.source.endpage524
dc.source.conferenceAdvances in Resist Technology and Processing XXI
dc.source.conferencedate22/02/2004
dc.source.conferencelocationSanta Clara, CA USA
imec.availabilityPublished - imec
imec.internalnotesProceedings of SPIE; VOl. 5376


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