Show simple item record

Understanding adhesion failure in low-k dielectric stacks during chemical mechanical polishing

dc.contributor.authorIacopi, Francesca
dc.contributor.authorDegryse, Dominiek
dc.contributor.authorVos, Ingrid
dc.contributor.authorPatz, Michael
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-10-15T14:00:33Z
dc.date.available2021-10-15T14:00:33Z
dc.date.issued2004-01
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/9082
dc.sourceIIOimport
dc.titleUnderstanding adhesion failure in low-k dielectric stacks during chemical mechanical polishing
dc.typeProceedings paper
dc.contributor.imecauthorVos, Ingrid
dc.contributor.imecauthorMaex, Karen
dc.source.peerreviewno
dc.source.beginpage131
dc.source.endpage136
dc.source.conferenceThin Film - Stresses and Mechanical Properties X
dc.source.conferencedate1/12/2003
dc.source.conferencelocationBoston, MA USA
imec.availabilityPublished - imec
imec.internalnotesMRS Symposium Proceedings; Vol. 795


Files in this item

FilesSizeFormatView

There are no files associated with this item.

This item appears in the following collection(s)

Show simple item record