Show simple item record

High-density hybrid interconnect technologies

dc.contributor.authorJohn, Joachim
dc.contributor.authorZimmermann, Lars
dc.contributor.authorDe Moor, Piet
dc.contributor.authorDe Munck, Koen
dc.contributor.authorBorgers, Tom
dc.contributor.authorVan Hoof, Chris
dc.date.accessioned2021-10-15T14:04:07Z
dc.date.available2021-10-15T14:04:07Z
dc.date.issued2004
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/9098
dc.sourceIIOimport
dc.titleHigh-density hybrid interconnect technologies
dc.typeProceedings paper
dc.contributor.imecauthorJohn, Joachim
dc.contributor.imecauthorDe Moor, Piet
dc.contributor.imecauthorDe Munck, Koen
dc.contributor.imecauthorBorgers, Tom
dc.contributor.imecauthorVan Hoof, Chris
dc.contributor.orcidimecBorgers, Tom::0000-0002-7878-6977
dc.source.peerreviewno
dc.source.beginpage1
dc.source.endpage8
dc.source.conferenceMicro-Optics: Fabrication, Packaging, and Integration
dc.source.conferencedate26/04/2004
dc.source.conferencelocationStrasbourg France
imec.availabilityPublished - imec
imec.internalnotesProceedings of SPIE; Vol 5454


Files in this item

FilesSizeFormatView

There are no files associated with this item.

This item appears in the following collection(s)

Show simple item record