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Patternable silicones for next generation packaging reliability requirements

dc.contributor.authorKunselman, Michael
dc.contributor.authorLarson, Lyndon
dc.contributor.authorHarkness, Brian
dc.contributor.authorGardner, Geoff
dc.contributor.authorAlger, James
dc.contributor.authorCummings, Michelle
dc.contributor.authorMeynen, Herman
dc.contributor.authorGonzalez, Mario
dc.contributor.authorVandevelde, Bart
dc.contributor.authorVanden Bulcke, Mathieu
dc.contributor.authorWinters, Christophe
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-15T14:16:22Z
dc.date.available2021-10-15T14:16:22Z
dc.date.issued2004
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/9152
dc.sourceIIOimport
dc.titlePatternable silicones for next generation packaging reliability requirements
dc.typeOral presentation
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorVanden Bulcke, Mathieu
dc.contributor.imecauthorWinters, Christophe
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.conferenceIMAPS : Topical Workshop and Exhibition on Flip Chip Technology
dc.source.conferencedate21/06/2004
dc.source.conferencelocationAustin, TX USA
imec.availabilityPublished - imec


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