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Finite element analysis of ultra thin BGA package: first and second level reliability

dc.contributor.authorLimaye, Paresh
dc.contributor.authorVandevelde, Bart
dc.contributor.authorde Vries, Hans
dc.contributor.authorDegryse, Dominiek
dc.contributor.authorSlob, Kees
dc.contributor.authorvan Veen, Co
dc.contributor.authorLabie, Riet
dc.date.accessioned2021-10-15T14:28:12Z
dc.date.available2021-10-15T14:28:12Z
dc.date.issued2004-05
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/9204
dc.sourceIIOimport
dc.titleFinite element analysis of ultra thin BGA package: first and second level reliability
dc.typeProceedings paper
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorLabie, Riet
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecLabie, Riet::0000-0002-1401-1291
dc.source.peerreviewno
dc.source.beginpage225
dc.source.endpage232
dc.source.conferenceEuroSimE: 5th Int. Conf. on Thermal & Mechanical Simulation and Experiments in Micro-Electronics and Micro-Systems
dc.source.conferencedate9/05/2004
dc.source.conferencelocationBrussel Belgium
imec.availabilityPublished - imec


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