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Reliability results of high density flip chip on flex assemblies

dc.contributor.authorMäättänen, Jarmo
dc.contributor.authorVandecasteele, Bjorn
dc.contributor.authorVanfleteren, Jan
dc.contributor.authorde Maquille, Yannick
dc.date.accessioned2021-10-15T14:37:46Z
dc.date.available2021-10-15T14:37:46Z
dc.date.issued2004
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/9241
dc.sourceIIOimport
dc.titleReliability results of high density flip chip on flex assemblies
dc.typeProceedings paper
dc.contributor.imecauthorVandecasteele, Bjorn
dc.contributor.imecauthorVanfleteren, Jan
dc.contributor.orcidimecVanfleteren, Jan::0000-0002-9654-7304
dc.source.peerreviewno
dc.source.beginpage89
dc.source.endpage93
dc.source.conferenceElektroniikan Valmistus 2004, Elektroniikan tuotanto-ja pakkaustekniikan konferenssii
dc.source.conferencedate13/05/2004
dc.source.conferencelocationPori Finland
imec.availabilityPublished - imec


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