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Integrating MEMS with standard CMOS using low temperature poly-SiGe technology

dc.contributor.authorPieters, Philip
dc.date.accessioned2021-10-15T15:26:53Z
dc.date.available2021-10-15T15:26:53Z
dc.date.issued2004
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/9426
dc.sourceIIOimport
dc.titleIntegrating MEMS with standard CMOS using low temperature poly-SiGe technology
dc.typeProceedings paper
dc.contributor.imecauthorPieters, Philip
dc.source.peerreviewno
dc.source.beginpage43
dc.source.conferenceProceedings of the 11th International KGD Packaging and Test Workshop
dc.source.conferencedate12/09/2004
dc.source.conferencelocationNapa, CA USA
imec.availabilityPublished - imec


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