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Packaging solution with a 3-dimensional coupling scheme for direct optical interconnects to the chip

dc.contributor.authorRits, Olivier
dc.contributor.authorBockstaele, Ronny
dc.contributor.authorBaets, Roel
dc.date.accessioned2021-10-15T15:50:26Z
dc.date.available2021-10-15T15:50:26Z
dc.date.issued2004
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/9512
dc.sourceIIOimport
dc.titlePackaging solution with a 3-dimensional coupling scheme for direct optical interconnects to the chip
dc.typeProceedings paper
dc.contributor.imecauthorRits, Olivier
dc.contributor.imecauthorBaets, Roel
dc.contributor.orcidimecBaets, Roel::0000-0003-1266-1319
dc.source.peerreviewno
dc.source.beginpage267
dc.source.endpage270
dc.source.conferenceProceedings Symposium IEEE/LEOS Benelux Chapter
dc.source.conferencedate2/12/2004
dc.source.conferencelocationGent Belgium
imec.availabilityPublished - imec


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