Effects of pre-amorphization implantation (PAI) in ultra shallow junctions formed by SPER in deep sub-micron devices
dc.contributor.author | Severi, Simone | |
dc.contributor.author | Henson, Kirklen | |
dc.contributor.author | Lindsay, Richard | |
dc.contributor.author | De Meyer, Kristin | |
dc.date.accessioned | 2021-10-15T16:09:21Z | |
dc.date.available | 2021-10-15T16:09:21Z | |
dc.date.issued | 2004-01 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/9579 | |
dc.source | IIOimport | |
dc.title | Effects of pre-amorphization implantation (PAI) in ultra shallow junctions formed by SPER in deep sub-micron devices | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Severi, Simone | |
dc.contributor.imecauthor | De Meyer, Kristin | |
dc.date.embargo | 9999-12-31 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 69 | |
dc.source.endpage | 72 | |
dc.source.conference | 5th European Workshop on Ultimate Integration of Silicon - ULIS | |
dc.source.conferencedate | 20/03/2004 | |
dc.source.conferencelocation | Leuven Belgium | |
imec.availability | Published - open access |