Influence of build-up epoxy layer surface roughness on the adhesion strength of electrochemically deposited copper
| dc.contributor.author | Siau, Sam | |
| dc.contributor.author | Vervaet, A. | |
| dc.contributor.author | Van Calster, Andre | |
| dc.contributor.author | Schacht, E. | |
| dc.date.accessioned | 2021-10-15T16:12:38Z | |
| dc.date.available | 2021-10-15T16:12:38Z | |
| dc.date.issued | 2004 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/9590 | |
| dc.source | IIOimport | |
| dc.title | Influence of build-up epoxy layer surface roughness on the adhesion strength of electrochemically deposited copper | |
| dc.type | Meeting abstract | |
| dc.contributor.imecauthor | Van Calster, Andre | |
| dc.source.peerreview | no | |
| dc.source.beginpage | 207 | |
| dc.source.conference | 205th Meeting of the Electrochemical Society. Meeting Abstracts | |
| dc.source.conferencedate | 9/05/2004 | |
| dc.source.conferencelocation | San Antonio, TX USA | |
| imec.availability | Published - imec |
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