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Influence of chemical pretreatment of epoxy polymers on the adhesion strength of electrochemically deposited Cu for use in electronic interconnections

dc.contributor.authorSiau, Sam
dc.contributor.authorVervaet, Alfons
dc.contributor.authorSchacht, Etienne
dc.contributor.authorVan Calster, Andre
dc.date.accessioned2021-10-15T16:13:29Z
dc.date.available2021-10-15T16:13:29Z
dc.date.issued2004
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/9593
dc.sourceIIOimport
dc.titleInfluence of chemical pretreatment of epoxy polymers on the adhesion strength of electrochemically deposited Cu for use in electronic interconnections
dc.typeJournal article
dc.contributor.imecauthorVan Calster, Andre
dc.source.peerreviewno
dc.source.beginpageC133
dc.source.endpageC141
dc.source.journalJournal of the Electrochemical Society
dc.source.issue2
dc.source.volume151
imec.availabilityPublished - imec


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