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Influence of chemical pretreatment of epoxy polymers on the adhesion strength of electrochemically deposited Cu for use in electronic interconnections
Publication:
Influence of chemical pretreatment of epoxy polymers on the adhesion strength of electrochemically deposited Cu for use in electronic interconnections
Date
2004
Journal article
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Siau, Sam
;
Vervaet, Alfons
;
Schacht, Etienne
;
Van Calster, Andre
Journal
Journal of the Electrochemical Society
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1919
since deposited on 2021-10-15
Acq. date: 2025-10-27
Citations
Metrics
Views
1919
since deposited on 2021-10-15
Acq. date: 2025-10-27
Citations