Publication:
Influence of chemical pretreatment of epoxy polymers on the adhesion strength of electrochemically deposited Cu for use in electronic interconnections
Date
| dc.contributor.author | Siau, Sam | |
| dc.contributor.author | Vervaet, Alfons | |
| dc.contributor.author | Schacht, Etienne | |
| dc.contributor.author | Van Calster, Andre | |
| dc.contributor.imecauthor | Van Calster, Andre | |
| dc.date.accessioned | 2021-10-15T16:13:29Z | |
| dc.date.available | 2021-10-15T16:13:29Z | |
| dc.date.issued | 2004 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/9593 | |
| dc.source.beginpage | C133 | |
| dc.source.endpage | C141 | |
| dc.source.issue | 2 | |
| dc.source.journal | Journal of the Electrochemical Society | |
| dc.source.volume | 151 | |
| dc.title | Influence of chemical pretreatment of epoxy polymers on the adhesion strength of electrochemically deposited Cu for use in electronic interconnections | |
| dc.type | Journal article | |
| dspace.entity.type | Publication | |
| Files | ||
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