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Thermo-compression flip chip bonding using gold ball bumps for RF and MEMS application

dc.contributor.authorStoukatch, Serguei
dc.contributor.authorWebers, Tomas
dc.contributor.authorWinters, Christophe
dc.contributor.authorBaert, Kris
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-15T16:29:08Z
dc.date.available2021-10-15T16:29:08Z
dc.date.issued2004
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/9646
dc.sourceIIOimport
dc.titleThermo-compression flip chip bonding using gold ball bumps for RF and MEMS application
dc.typeProceedings paper
dc.contributor.imecauthorWebers, Tomas
dc.contributor.imecauthorWinters, Christophe
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.beginpage163
dc.source.endpage168
dc.source.conferenceProceedings of the 15th European Microelectronics and Packaging Symposium
dc.source.conferencedate16/06/2004
dc.source.conferencelocationPrague Czech Republic
imec.availabilityPublished - imec


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