dc.contributor.author | Vandecasteele, Bjorn | |
dc.contributor.author | Määttänen, Jarmo | |
dc.contributor.author | Podprocky, Tomas | |
dc.contributor.author | Vanfleteren, Jan | |
dc.date.accessioned | 2021-10-15T17:19:36Z | |
dc.date.available | 2021-10-15T17:19:36Z | |
dc.date.issued | 2004 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/9808 | |
dc.source | IIOimport | |
dc.title | Low temperature flip chip attachment for flexible display applications | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Vandecasteele, Bjorn | |
dc.contributor.imecauthor | Vanfleteren, Jan | |
dc.contributor.orcidimec | Vanfleteren, Jan::0000-0002-9654-7304 | |
dc.source.peerreview | no | |
dc.source.beginpage | 307 | |
dc.source.endpage | 312 | |
dc.source.conference | International Conference on Electronics Packaging - ICEP | |
dc.source.conferencedate | 14/04/2004 | |
dc.source.conferencelocation | Tokyo Japan | |
imec.availability | Published - imec | |
imec.internalnotes | Formerly IEMT/IMC Symposium | |