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Thermal cycling reliability of SnAgCu and SnPb solder joints: a comparison of for several IC-packages

dc.contributor.authorVandevelde, Bart
dc.contributor.authorGonzalez, Mario
dc.contributor.authorLimaye, Paresh
dc.contributor.authorRatchev, Petar
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-15T17:26:34Z
dc.date.available2021-10-15T17:26:34Z
dc.date.issued2004-05
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/9830
dc.sourceIIOimport
dc.titleThermal cycling reliability of SnAgCu and SnPb solder joints: a comparison of for several IC-packages
dc.typeProceedings paper
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.beginpage565
dc.source.endpage570
dc.source.conferenceEuroSimE: 5th Int. Conf. on Thermal & Mechanical Simulation and Experiments in Micro-Electronics and Micro-Systems
dc.source.conferencedate9/05/2004
dc.source.conferencelocationBrussels Belgium
imec.availabilityPublished - imec


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