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Lead free solder joint reliability estimation by finite element modelling, advantages, challenges and limitations
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Authors
Vandevelde, Bart
;
Gonzalez, Mario
;
Limaye, Paresh
;
Ratchev, Petar
;
Vanfleteren, Jan
;
Beyne, Eric
Conference
7th IPC International Conference on Lead Free Electronic Components and Assemblies
Title
Lead free solder joint reliability estimation by finite element modelling, advantages, challenges and limitations
Publication type
Proceedings paper
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