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A new method for the lifetime determination of submicron metal interconnects by means of parallel test structure

dc.contributor.authorVanstreels, Kris
dc.contributor.authorD'Olieslaeger, Marc
dc.contributor.authorDe Ceuninck, Ward
dc.contributor.authorD'Haen, Jan
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-10-15T17:28:48Z
dc.date.available2021-10-15T17:28:48Z
dc.date.issued2004
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/9837
dc.sourceIIOimport
dc.titleA new method for the lifetime determination of submicron metal interconnects by means of parallel test structure
dc.typeProceedings paper
dc.contributor.imecauthorVanstreels, Kris
dc.contributor.imecauthorD'Olieslaeger, Marc
dc.contributor.imecauthorDe Ceuninck, Ward
dc.contributor.imecauthorD'Haen, Jan
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecVanstreels, Kris::0000-0002-4420-0966
dc.source.peerreviewno
dc.source.beginpage633
dc.source.endpage636
dc.source.conferenceProceedings 24th International Conference on Microelectronics - MIEL
dc.source.conferencedate16/05/2004
dc.source.conferencelocationNis Serbia and Montenegro
imec.availabilityPublished - imec


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