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Removal of nano-particles and structural damage in megasonic cleaning of silicon wafers

dc.contributor.authorVereecke, Guy
dc.contributor.authorHolsteyns, Frank
dc.contributor.authorArnauts, Sophia
dc.contributor.authorKenis, Karine
dc.contributor.authorLux, Marcel
dc.contributor.authorVos, Rita
dc.contributor.authorSnow, Jim
dc.contributor.authorMertens, Paul
dc.date.accessioned2021-10-15T17:35:44Z
dc.date.available2021-10-15T17:35:44Z
dc.date.issued2004
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/9858
dc.sourceIIOimport
dc.titleRemoval of nano-particles and structural damage in megasonic cleaning of silicon wafers
dc.typeOral presentation
dc.contributor.imecauthorVereecke, Guy
dc.contributor.imecauthorHolsteyns, Frank
dc.contributor.imecauthorArnauts, Sophia
dc.contributor.imecauthorKenis, Karine
dc.contributor.imecauthorLux, Marcel
dc.contributor.imecauthorVos, Rita
dc.contributor.imecauthorMertens, Paul
dc.contributor.orcidimecVereecke, Guy::0000-0001-9058-9338
dc.source.peerreviewno
dc.source.conference9th International Symposium on Particles on Surfaces
dc.source.conferencedate16/06/2004
dc.source.conferencelocationPhiladelphia, PA USA
imec.availabilityPublished - imec


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