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Through pitch low-k1 contact hole imaging with CPLTM technology

dc.contributor.authorWiaux, Vincent
dc.contributor.authorBekaert, Joost
dc.contributor.authorFung Chen, J.
dc.contributor.authorHsu, Stephen
dc.contributor.authorRonse, Kurt
dc.contributor.authorSocha, Robert
dc.contributor.authorVandenberghe, Geert
dc.contributor.authorVan Den Broeke, Douglas
dc.date.accessioned2021-10-15T17:54:52Z
dc.date.available2021-10-15T17:54:52Z
dc.date.issued2004
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/9917
dc.sourceIIOimport
dc.titleThrough pitch low-k1 contact hole imaging with CPLTM technology
dc.typeProceedings paper
dc.contributor.imecauthorWiaux, Vincent
dc.contributor.imecauthorBekaert, Joost
dc.contributor.imecauthorRonse, Kurt
dc.contributor.imecauthorVandenberghe, Geert
dc.contributor.orcidimecBekaert, Joost::0000-0003-3075-3479
dc.contributor.orcidimecRonse, Kurt::0000-0003-0803-4267
dc.source.peerreviewno
dc.source.beginpage585
dc.source.endpage594
dc.source.conferencePhotomask and Next-Generation Lithography Mask Technology XI
dc.source.conferencedate14/04/2004
dc.source.conferencelocationYokohama, Kanagawa Japan
imec.availabilityPublished - imec
imec.internalnotesProceedings of SPIE; Vol. 5446


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