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Characterization and modeling of transient device behavior under CMD ESD stress

dc.contributor.authorWillemen, J.
dc.contributor.authorAndreini, A.
dc.contributor.authorDe Heyn, Vincent
dc.contributor.authorEsmark, K.
dc.contributor.authorEtherton, M.
dc.contributor.authorGieser, H.
dc.contributor.authorGroeseneken, Guido
dc.contributor.authorMettler, S.
dc.contributor.authorMorena, E.
dc.contributor.authorQu, N.
dc.contributor.authorSoppa, W.
dc.contributor.authorStadler, W.
dc.contributor.authorStella, R.
dc.contributor.authorWilkening, W.
dc.contributor.authorWolf, H.
dc.contributor.authorZullino, L.
dc.date.accessioned2021-10-15T17:56:20Z
dc.date.available2021-10-15T17:56:20Z
dc.date.issued2004
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/9921
dc.sourceIIOimport
dc.titleCharacterization and modeling of transient device behavior under CMD ESD stress
dc.typeJournal article
dc.contributor.imecauthorDe Heyn, Vincent
dc.contributor.imecauthorGroeseneken, Guido
dc.source.peerreviewno
dc.source.beginpage133
dc.source.endpage153
dc.source.journalJournal of Electrostatics
dc.source.issue2_3
dc.source.volume62
imec.availabilityPublished - imec
imec.internalnotesPaper from 2003 EOS/ESD Symposium


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