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Electrical and microstructural characterization of narrow Cu interconnects

dc.contributor.authorWu, Wen
dc.contributor.authorBrongersma, Sywert
dc.contributor.authorVervoort, Iwan
dc.contributor.authorBender, Hugo
dc.contributor.authorVan Hove, Marleen
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-10-15T18:01:50Z
dc.date.available2021-10-15T18:01:50Z
dc.date.issued2004
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/9938
dc.sourceIIOimport
dc.titleElectrical and microstructural characterization of narrow Cu interconnects
dc.typeProceedings paper
dc.contributor.imecauthorBrongersma, Sywert
dc.contributor.imecauthorBender, Hugo
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecBrongersma, Sywert::0000-0002-1755-3897
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage225
dc.source.endpage229
dc.source.conferenceAdvanced Metallization Conference 2003
dc.source.conferencedate21/10/2003
dc.source.conferencelocationMontreal/Tokyo
imec.availabilityPublished - open access
imec.internalnotesConference Proceedings AMC XIX


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