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Particle adhesion and removal mechanisms during brush scrubber cleaning in post-CMP processes

dc.contributor.authorXu, Kaidong
dc.contributor.authorVos, Rita
dc.contributor.authorVereecke, Guy
dc.contributor.authorFyen, Wim
dc.contributor.authorHolsteyns, Frank
dc.contributor.authorDoumen, Geert
dc.contributor.authorMertens, Paul
dc.contributor.authorHeyns, Marc
dc.contributor.authorVinckier, Chris
dc.contributor.authorFransaer, J.
dc.date.accessioned2021-10-15T18:04:14Z
dc.date.available2021-10-15T18:04:14Z
dc.date.issued2004
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/9945
dc.sourceIIOimport
dc.titleParticle adhesion and removal mechanisms during brush scrubber cleaning in post-CMP processes
dc.typeProceedings paper
dc.contributor.imecauthorVos, Rita
dc.contributor.imecauthorVereecke, Guy
dc.contributor.imecauthorHolsteyns, Frank
dc.contributor.imecauthorDoumen, Geert
dc.contributor.imecauthorMertens, Paul
dc.contributor.imecauthorHeyns, Marc
dc.contributor.orcidimecVereecke, Guy::0000-0001-9058-9338
dc.source.peerreviewno
dc.source.conferenceInternational Conference on Microelectronics and Interfaces - ICMI
dc.source.conferencedate1/03/2004
dc.source.conferencelocationSanta Clara, CA USA
imec.availabilityPublished - imec


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